Syenta Joins ASTRA to Showcase Breakthrough in Advanced Packaging

News

August 6, 2025

Syenta is proud to join ASTRA 2024 by Applied Ventures & Applied Materials India. We showcased Achyon, our production tool for Advanced Packaging, powered by Localized Electrochemical Manufacturing (LEM) technology.

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News

Syenta Awarded $4.8M Grant to Advance Semiconductor Manufacturing

Syenta has secured $4.8M AUD in Industry Growth Program funding to commercialise its LEM semiconductor packaging technology, accelerating the move from development to production and supporting global scale.

News

Pat Gelsinger joins Syenta's board as Playground Global and NRF lead A$37M raise

Syenta raises Series A from Playground Global and Australia’s National Reconstruction Fund to scale semiconductor innovation; Pat Gelsinger (Ex-CEO of Intel) joins the board.

Publications

Syenta Featured in Forbes - Breaking the AI memory wall through ultra-high bandwidth High-Resolution Interconnects

Syenta has been featured in Forbes - revolutionizing chip packaging, breaking the AI memory wall, and powering faster, smarter AI and High Performance Computing (HPC) worldwide.

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