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Advanced Packaging of chips at 100x the speed

Our manufacturing product accelerates and enables the production of high-performance semiconductor chips

Our Partners

Our Technology

Our patented electrochemistry-based method makes us the world's fastest and highest-performing manufacturing equipment provider


100x faster than traditional methods

Reduced Steps

Reduce up to 60% steps of manufacturing

Large Area

Full size panel and wafer deposition


Demonstrated 4 µm
Aiming for 1 µm

Material Quality

90% of conductivity of bulk copper

Ultra-High Efficiency

98% less embodied energy than photolithography, and 95% less CO2 emissions

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Unprecedented Velocity, Impeccable Reliability.

Reach out to us about our upcoming product launch.

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