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Our Technology
Our patented electrochemistry-based method makes us the world's fastest and highest-performing manufacturing equipment provider
Speed
100x faster than traditional methods
Reduced Steps
Reduce up to 60% steps of manufacturing
Large Area
Full size panel and wafer deposition
Resolution
Demonstrated 4 µm
Aiming for 1 µm
Material Quality
90% of conductivity of bulk copper
Ultra-High Efficiency
98% less embodied energy than photolithography, and 95% less CO2 emissions
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